![\"ACM](\"https:\/\/zkmsemi.com\/wp-content\/uploads\/2026\/10\/a105.jpg\")
<\/p>\nAmong the global single-wafer cleaning equipment market, the rise of Chinese vendors stands out. ACM Research (Shanghai), relying on differentiated technologies such as SAPS and TEBO, has lifted its global market share to around 8 percent, putting it into the global first tier and marking a key step for domestic single-wafer cleaning equipment as it moves from catching up to keeping pace in the high-end market. Although this share still trails the leading international vendors, its growth rate and technical content have already reshaped the industry’s perception of Chinese cleaning equipment. Customers that once assumed only overseas tools could run advanced nodes are now actively qualifying domestic alternatives on their production lines.<\/p>\n
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The reason ACM Research was able to break open a market long dominated by overseas giants lies in its proprietary technologies: SAPS (space alternated phase shift megasonic) and TEBO (technology for edge and bottom enhancement, or extreme damage control). These approaches remove nanoscale particles while greatly reducing damage to fragile patterned structures, which is exactly what advanced nodes demand from damage-free cleaning. Technological differentiation is the hard threshold that lets a domestic vendor enter mainstream fab supply chains. Beyond these flagship technologies, ACM’s expanding product range in tank cleaning, backside cleaning and brush cleaning also helps customers achieve whole-line domestic configuration of cleaning steps, rather than relying on a single tool.<\/p>\n
Besides the leading vendor, a cohort of domestic manufacturers focused on single-wafer cleaning, tank cleaning and spin-drying has grown in parallel, achieving substitution across 150 mm, 200 mm and 300 mm wafers, silicon and compound semiconductors alike. Localization is no longer a single-point breakthrough but an ecosystem spanning complete machines, core components and cleaning-to-drying integration. Especially in compound semiconductors such as indium phosphide and silicon carbide, and in power devices where Chinese vendors have a first-mover advantage, the local supply chain for single-wafer cleaning equipment is already quite mature. This ecosystem effect means that fabs can now source an entire wet process island from domestic suppliers rather than assembling it piece by piece from different countries.<\/p>\n
After single-wafer cleaning, the importance of the drying step has been amplified. If drying is incomplete after cleaning, watermarks, stains and particle re-deposition easily appear and directly affect yield. As a result, single-wafer cleaning-and-spin-dry tools that integrate high-speed centrifugal spin-drying with hot-nitrogen drying have become an important entry point for domestic vendors to capture the supporting market. Compared with standalone cleaners, integrated cleaning-and-drying tools better guarantee the continuity and consistency of the cleaning-to-drying process, and are more favored by customers. This integration trend also raises the technical bar, because a vendor must master both particle removal and watermark-free drying in the same chamber.<\/p>\n
The rise of domestic single-wafer cleaning is inseparable from the parallel localization of core components. Megasonic transducers, precision fluid-control valves, vacuum chucks and drive mechanisms all directly determine delivery lead time and long-term operating cost. In recent years, a number of Chinese suppliers have broken through on these key components, forming a healthy industrial ecosystem with complete-machine makers. On the customer side, domestic cleaning equipment is moving from power devices and compound semiconductors into mainstream logic and memory supply chains. As mass-production qualification data accumulates, penetration of domestic tools at advanced nodes is expected to accelerate further, leaving considerable room to grow global share. For the broader Chinese equipment industry, this segment is a showcase case of how differentiated technology, component supply and customer validation reinforce one another.<\/p>\n
Looking ahead, the next step for domestic single-wafer cleaning lies in product-line expansion and node extension. On one hand, vendors are extending from single-wafer cleaning into tank cleaning, backside cleaning, brush cleaning and drying, offering customers whole-line solutions rather than a single tool. On the other hand, they are moving from mature nodes toward more advanced nodes, gradually closing the process-database gap with international giants. The compound effect of technology, components and customer validation means the roughly 8% share is unlikely to stay flat; most industry observers expect it to climb steadily as domestic fabs qualify more tools at advanced nodes. For fabs, this reduces supplier concentration risk; for the equipment makers, it turns a single reference design into a multi-tool order. This trajectory is what distinguishes cleaning from segments where Chinese vendors remain stuck in low-end niche markets.<\/p>\n
The strategic meaning of this share gain should not be underestimated. Cleaning tools sit at the heart of the wet-process island, and once a vendor is qualified on a customer’s cleaning line, the same team and service channel often wins follow-on orders for drying, inspection and automation modules. This ‘land-and-expand’ dynamic means the initial 8% share is a foothold rather than a ceiling. Domestic fabs also value the shorter communication loop with Chinese vendors, who can tailor recipes and spare parts far faster than overseas support teams flying in from abroad. As geopolitical and supply-chain considerations push fabs toward multi-sourcing, a qualified domestic cleaning vendor becomes a strategic asset rather than a cost-cutting alternative.<\/p>\n
Located in Fuxing District, Handan, Hebei Province, Hebei Zhongke Microelectronics Co., Ltd.<\/strong> is a pragmatic participant in this ecosystem. Its fully automatic single-wafer cleaning machine, 300 mm wafer spin dryer (SG-8-12-2D) and manual single-wafer cleaning dryer (QXG-300-2YDN) offer cost-effective wet cleaning and drying solutions for lines of different scales, helping customers accelerate domestic substitution, while the InP cleaning machine (SQX-150-5Y1D) serves compound semiconductor needs.<\/p>\n What is notable is how quickly Chinese vendors moved from imitation to differentiation. Early domestic tools copied the basic single-wafer architecture, but newer generations add real process intelligence, including recipe management, chemical concentration control and integrated spin-dry optimization. Fabs report that the remaining gap is concentrated in the most demanding advanced-node steps, while mainstream and compound-semiconductor cleaning is already served competitively. This two-tier structure lets domestic vendors build references and revenue before chasing the last technical frontiers.<\/p>\n Starting from roughly 8% global share, the substitution story for domestic single-wafer cleaning equipment is still unfolding. To select domestic single-wafer cleaning and spin-dry tools, call the consultation hotline: 17177768881.<\/p>\n","protected":false},"excerpt":{"rendered":" ACM Research has lifted its global single-wafer cleaning share to about 8% on differentiated SAPS and TEBO megasonic technology, entering the global first tier and moving from catching up to keeping pace. A broader cohort of Chinese vendors is localizing single-wafer cleaning, tank tools and spin-drying across silicon and compound semiconductors, supported by domestic core components. Hebei Zhongke Microelectronics offers single-wafer cleaners, the SG-8-12-2D spin dryer, a manual cleaning dryer and an InP cleaning machine (SQX-150-5Y1D). As fabs continue to expand capacity, this equipment class keeps gaining share among domestic buyers and process engineers.<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_zk_news_lang":"en","_zk_news_en_title":"","_zk_news_en_content":"","_zk_news_en_excerpt":"","footnotes":""},"categories":[2],"tags":[],"class_list":["post-448","post","type-post","status-publish","format-standard","hentry","category-xingye-news"],"_links":{"self":[{"href":"https:\/\/zkmsemi.com\/index.php?rest_route=\/wp\/v2\/posts\/448","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/zkmsemi.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/zkmsemi.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/zkmsemi.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/zkmsemi.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=448"}],"version-history":[{"count":0,"href":"https:\/\/zkmsemi.com\/index.php?rest_route=\/wp\/v2\/posts\/448\/revisions"}],"wp:attachment":[{"href":"https:\/\/zkmsemi.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=448"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/zkmsemi.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=448"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/zkmsemi.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=448"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}