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122026.10

Compound Semiconductor National Standards System Matures as Substrate and Epitaxy Standards Roll Out

China’s compound semiconductor…

122026.10

化合物半导体标准体系日趋完善 衬底与外延材料国家标准密集出台

全国半导体设备和材料标准化技术委员会持续完善化合物半导体标准…

122026.10

Global Semiconductor Equipment Sales Set for Another Record in 2026 as Wafer Cleaning Localization Accelerates

Driven by AI capacity expansio…

122026.10

2026年全球半导体设备销售额有望再创历史新高 晶圆清洗环节国产替代加速落地

SEMI预测2026年全球半导体制造设备销售额达1659亿美…

112026.10

Fab Expansion Forces Facility Upgrades: Cleanrooms, UPW and Specialty Gases as New Infrastructure

Fab expansion is driving facil…

112026.10

晶圆厂扩产倒逼厂务升级:洁净室、超纯水与特气配套成新基建

半导体洁净室核心区域需达ISO 3-5级,温湿度精度±0.1…

112026.10

China’s Wafer Cleaning Equipment Localization Crosses 50% as Single-Wafer Cleaning and Spin-Dryers Lead Fab Expansion

Domestic wafer cleaning equipm…

112026.10

国产晶圆清洗设备市占率过半:单片清洗与甩干环节成扩产主力

2026年全球晶圆清洗设备市场规模预计达87亿美元,清洗设备…

102026.10

China’s IC Talent Gap Tops 300,000 as Industry-Education Integration Ramps Up Equipment Engineers

China's integrated circuit tal…

102026.10

集成电路人才缺口突破30万 产教融合加速培养设备工艺工程师

中国集成电路行业人才缺口已突破30万人,具备产线实操经验的工…

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