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062026.10

AI Data Center Boom Pulls Indium Phosphide Substrate Demand Higher; Tight Supply Persists Into 2026

As 800G and 1.6T optical modul…

062026.10

AI算力爆发拉动磷化铟衬底走俏 国产InP单晶产能紧俏格局延续

AI算力爆发拉动磷化铟衬底需求，800G/1.6T光模块放量…

062026.10

Mature-Node Utilization Nears Full Capacity as Automotive and Industrial Chips Underpin Fab Load

After a two-year inventory cor…

062026.10

成熟制程产能利用率逼近满载 车载与工控芯片需求成为晶圆厂稼动率的坚实支撑

中芯国际二季度产能利用率升至93.7%，华虹达102.8%，…

052026.10

Czochralski vs. VGF: Why Compound Semiconductors Favor Gradient Freeze Crystal Growth

In compound semiconductor crys…

052026.10

提拉法与VGF法长晶路线之争 化合物半导体单晶生长工艺解析

提拉法（CZ）与VGF法各有适用场景：硅基大尺寸单晶以提拉法…

052026.10

Metrology Becomes the Key to Yield: The Industry’s ‘Eyes’ Support Advanced-Process Ramp

Metrology and inspection equip…

052026.10

量测检测成良率提升关键 半导体”眼睛”支撑先进制程爬坡

半导体量测设备被称为芯片制造的眼睛，贯穿光刻刻蚀沉积全流程，…

042026.10

Advanced Processes Drive Cleanroom Upgrades as Class 10/100 Cleanrooms Become Fab Standard

Advanced processes and advance…

042026.10

先进制程驱动洁净室升级 十级百级洁净厂房成晶圆厂标配

先进制程光刻区需ISO 1至4级超高洁净环境，百级ISO5广…