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042026.10

VGF Crystal Growth Furnaces Become Mainstream as InP and GaAs Production Localizes

With demand for InP and GaAs s…

042026.10

VGF法单晶炉跻身主流装备 磷化铟砷化镓晶体生长国产化提速

垂直梯度凝固法（VGF）因热应力低、位错密度小成为磷化铟、砷…

032026.10

UPW and Wet Electronic Chemicals: The ‘Water Infrastructure’ Behind Wafer Cleaning

Ultra-pure water and wet elect…

032026.10

超纯水与湿电子化学品：晶圆清洗背后的水刚需与配套逻辑

半导体是超纯水最大下游，2025年约占全球UPW系统市场53…

032026.10

Hebei Positions for Third-Generation Semiconductors as Handan Builds Materials Cluster

Hebei is accelerating its thir…

032026.10

河北布局第三代半导体产业 邯郸培育化合物材料与电子特气集群

河北省出台促进电子信息产业高质量发展政策，以第三代半导体、电…

032026.10

Nexchip Phase IV and Hua Hong Wuxi Phase III Kick Off One After Another as China’s 300mm Fabs Keep Expanding

Following earlier 300mm lines,…

032026.10

晶合集成四期与华虹无锡三期相继启动 国内12英寸晶圆厂扩产步伐不停

晶合集成总投资355亿元四期项目启动、预计四季度投产，华虹无…

022026.10

Advanced Packaging Reshapes Wet Cleaning: New Requirements for TSV, HBM and Hybrid Bonding

Advanced packaging including T…

022026.10

先进封装拉动湿法清洗升级：TSV、HBM与混合键合的新要求

2.5D/3D堆叠、TSV深孔与HBM凸点清洗对颗粒去除率、…