EFEM Cleaner & Spin Dryer
01 Product Overview
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SG-8-12-2D EFEM cleaner & spin dryer is a high-cleanliness wafer cleaning and drying machine designed for integration with the Equipment Front End Module (EFEM), combining high-speed centrifugal drying with double-side N2 hot-air drying - high efficiency, wide compatibility and low cost. With quick Chuck change, it covers cleaning & drying of 2-12 inch semiconductor wafers, masks and various substrates; it can be used as a standalone station or directly embedded into the EFEM to connect seamlessly with the wafer transfer robot and load ports for full automation.
Product Name: EFEM Cleaner & Spin Dryer
Model: SG-8-12-2D
Application: EFEM equipment front end module - semiconductor wafers - masks - substrates cleaning & drying
Core Features: EFEM integration - high-speed drying - double-side blow drying - quick changeover - high cleanliness
01 EFEM Adaptation
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Seamless integration with EFEM
Standard mechanical and electrical interfaces connect directly to EFEM load ports and transfer robots, supporting automatic wafer loading/unloading for automated front- and back-end lines.
SECS-GEM / SMEMA communication (customizable)
Host PC control, integration with EFEM management and MES systems for remote recipe setting, status monitoring and data traceability.
Compact integrated design
Overall dimensions 450 x 490 x 660mm - small footprint, adapted to EFEM integration space for easy line layout and automation retrofit.
External start / host communication
External signal start and host communication enable timing linkage with EFEM robots for automated production rhythm.
02 Structure & Features
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Imported PP housing
Imported polypropylene sheet - corrosion-resistant, low particle shedding, fully meets cleanroom requirements.
Dedicated servo drive
Speed 10-4000 RPM infinitely adjustable: uniform cleaning at low speed, strong centrifugal drying at high speed - two functions in one.
Industrial PLC + 7 inch touch screen
Stable industrial control with intuitive HMI; process parameters set with one click.
PFA piping system
DIW and N2 lines in PFA perfluoro material - chemical resistant, low metal leaching, ensuring a high-cleanliness process environment.
Double-side N2 blow drying
Independent N2 flow control on front and back sides; complete drying in 90-120 seconds, water-mark and particle free.
Quick-change Chuck
Fast spin-head change by wafer size, 2-12 inch compatible, short changeover time, higher line efficiency.
| Integration | Standard EFEM front-end module docking, automatic wafer loading/unloading |
|---|---|
| Communication | SECS-GEM / SMEMA (customizable), host & MES integration |
| Wafer Size | 6-12 inch round wafers (change Chuck per size) |
| Wafers per Cycle | 1 |
| Stations | 1 |
| Rotation Speed | No-load 10-4000 R/Min (servo driven) |
| Drying Method | Centrifugal + double-side N2 blow |
| Blow | 2 sides (front/rear) independently controlled |
| N2 Flow Control | 2 lines (front & rear separately) |
| Cycle Time | 90-120s complete drying (with blow) |
| N2 Pressure | 0.35-0.4 MPa (port phi6mm) |
| CDA Pressure | 0.35-0.4 MPa (port phi6mm) |
| Drain Port | phi12mm ferrule fitting |
| Display/Control | 7 inch touch screen + PLC |
| Splash Ring Lift | Supported (PP/PE) |
| Fixed-Position Stop | Supported |
| Empty-Wafer Detection | Supported (ultrasonic) |
| External Start / Host Comm | Supported |
| Piping | PFA |
| Power | 220V AC |
| Power Rating | 1.5KW |
| Dimensions | 450 x 490 x 660mm |
| Wafer Range | 2-12 inch (quick Chuck change) |
| Footprint | 450 x 490mm (compact) |
Need selection guidance or a customized solution? Talk to our engineers.
