Wafer Spin Dryer (6/8 inch)

1. Overview

1.1 Application: wafer spin dryers are widely used in semiconductor manufacturing, especially in cleaning, lithography and etching steps. As an important part of the wafer production line, they improve wafer quality and efficiency by ensuring a clean, residue-free surface for downstream processes.

The main function of the wafer spin dryer is to remove residual cleaning liquid and impurities from the wafer surface by centrifugal force, leaving it dry and clean. This is critical for subsequent processes - any residual liquid or contamination affects wafer quality and production efficiency.

1.2 Name: Wafer Spin Dryer

1.3 Model: CSM880S

1.4 Dimensions: 710 x 520 x 1850 mm

1.5 Wafer Spec: 2-8 inch

2. Main Structure

2.1 Structure

Mainly composed of spindle drive, cassette fixture, process chamber, frame, door, clean piping and electrical control.

Material: stainless steel frame + 10mm PP housing

Frame: SUS304 stainless steel, cleanroom compatible.

Chamber & carrier in corrosion-resistant SUS316L stainless steel with electrochemical polishing. Carrier easily replaceable.

Motor and rotor precisely dynamically balanced to reduce resonance.

Custom brushless motor & controller for stability, reliability and cleanliness requirements.

Piping: PFA clean tubing

2.2 Process Chamber & Carrier

Process chambers: 2, SUS316L (electro-polished)

Spec: full-height cassettes 2-8 inch, compatible

Operating speed: 200-2200 RPM/MIN

Heating: N2 heating / chamber heating

Shaft seal: N2 shaft seal for motor spindle

2.3 DI Water Control Unit

Fan-type rinse nozzles.

Resistivity probe on drain to monitor chamber water quality.

After rinse, N2 purges DI water left in the rinse line.

On standby, water flows into the return box with adjustable flow.

2.4 Nitrogen Control Unit

Valves: SMC solenoid valves, PFA high-purity fittings, PTFE pneumatic valves.

N2 heating: in-line 316SS heater, temp-switch control, 80 degree C.

High-purity regulator with built-in N2 filter, 0.003um.

2.5 Static Control Unit

High-voltage generator, N2 ionization chamber and N2 control channels.

N2 ionizes through the process chamber, neutralizing static.

2.6 Particle Level

Particle adders: to be confirmed with customer.

2.7 Electrical Control & Software

Process controlled by PLC + touch screen; multiple user recipe menus, time/speed settable per menu.

Password permission, fault display and alarm. On fault the system stops, shows error and alarms for corrective action.

2.8 Process Flow

DIW spin rinse + centrifugal dry + N2 baking