Cleaning Equipment
Contactless Wafer Unloader
Contactless wafer unloader (XP-8) is designed to unload polished wafers from ceramic plates without contact, supporting 2-6 inch wafers. Dimensions: L1190 x W600 x H1120mm.
01Product Details
1. Overview
1.1 Application: contactless unloading of polished wafers from ceramic plates.
1.2 Name: Contactless Wafer Unloader
1.3 Model: XP-8
1.4 Dimensions: L1190mm x W600mm x H1120mm
1.5 Wafer Spec: 2-6 inch
2. Key Specifications
Wafer Size: 2-6 inch round wafers
Ceramic Plate Diameter: 485mm (change fixture for different plate sizes)
02Technical Specifications
| Equipment Name | Contactless Wafer Unloader |
|---|---|
| Model | XP-8 |
| Wafer Size | 2-6 inch round wafers |
| Ceramic Plate Diameter | 485mm (change fixture for different plate sizes) |
| Dimensions | L1190 x W600 x H1120 mm |
| Wafer Spec | 2-6 inch |
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