Processing Equipment
Manual Wafer Edge Grinder
The wafer edge grinder is a precision semiconductor tool for accurate edge chamfering of silicon, SiC or sapphire wafers, removing burrs and sharp edges, improving edge quality, yield and safety.
01Product Details
The wafer edge grinder is a precision semiconductor production tool specially designed for accurate edge chamfering of silicon, silicon carbide or sapphire wafers. It removes burrs and sharp edges after cutting, improves wafer edge quality and ensures yield and safety in downstream chip manufacturing.
Key Specifications
Model: DJ-150 (2-6 Inch) / DJ200 (4-8 Inch)
Wafer Thickness: 300um ~ 1200um (customizable)
Processing Diameter: 5mm ~ 65mm
Spindle Speed: 6000rpm
02Technical Specifications
| Model | DJ-150 / DJ200 |
|---|---|
| Wafer Size | 2-6 inch (DJ-150) / 4-8 inch (DJ200) |
| Wafer Thickness | 300um ~ 1200um (customizable) |
| Wafer Shape | Wafers and round-edge wafers |
| Processing Diameter | 5mm ~ 65mm |
| Spindle Speed | 6000rpm |
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