Fully Automatic Single-Wafer Cleaning Machine

1. Machine Description

1.1 Overview

The fully automatic single-wafer cleaning machine adopts advanced cleaning technology and an automated control system to clean each wafer efficiently and precisely in a dust-free environment. It typically includes a wafer transfer system, chemical solution supply system, UPW rinse system and drying system.

Wafer transfer: robot or manipulator handles wafers automatically from loading to unloading.

Chemical supply: provides different types and concentrations of chemical cleaners per process.

UPW rinse: high-purity deionized water removes residues from the wafer surface.

Megasonic system: megasonic water removes tiny residues from the wafer surface.

1.2 Process Flow

Wafer loading: wafers placed in dedicated carriers and fed into the machine.

Chemical cleaning: suitable chemicals selected for immersion or spray cleaning.

UPW rinse: ultra-pure water thoroughly rinses chemicals and residues.

Megasonic: megasonic water removes tiny surface residues.

Wafer unloading: cleaned wafers safely removed.

1.3 Layout (subject to final design)

Machine appearance

Cleaning unit design

Design highlights:

1. V-shaped tank bottom for easy drain, no residue.

2. Rotating swing-arm spray, Teflon-coated, clean, corrosion- and wear-resistant (sulfuric acid resistant), preventing splashing corrosion and particle generation.

3. Hollow direct-drive spindle motor, avoiding particles and vibration from belt drive.

4. All motors and cylinders at the chamber bottom, avoiding corrosive gas damage and particle contamination of wafers.

5. Exhaust: three side exhausts per chamber plus bottom chemical exhaust; 3 chambers with two 110mm exhaust pipes (4 main pipes total), each chamber with exhaust regulating valve.

6. Front and back cleaning with integrated suction valves and manual flow valves, independently adjustable; in-line flow meters on both sides with alarm if out of range.

7. Hollow CHUCK (high-temp sulfuric acid resistant) prevents splash rebound and water/chemical marks that reduce yield. Retaining posts firmly fixed to the base, easy to replace; max radial displacement <= 0.5mm at high speed; breakage rate < 0.05%; no chemical residue on the back-side platform.