Manual Single-Wafer Cleaner & Spin Dryer
1. Overview
1.1 Application: the single-wafer cleaner & dryer is high-cleanliness cleaning and drying equipment with high-speed spin drying, fast baking and high efficiency. Different wafer sizes are handled by quick spin-head replacement. Mainly for brushing and drying of 2-4 inch semiconductor wafers, masks and various substrates - cost-effective and production-ready.
1.2 Name: Single-Wafer Cleaner & Spin Dryer
1.3 Model: QXG-300-2YDN
2. Main Structure
Mainly consists of servo motor, PLC controller, HMI, high-cleanliness valves, PFA tubing, nitrogen heater, corrosion-resistant imported PP housing and spin head.
2.1 Material: imported PP sheet, cleanroom compatible.
2.2 Dedicated servo motor: 10-5000 RPM, low-speed uniform cleaning, high-speed centrifugal drying.
2.3 Industrial PLC controller with HMI for stable control and intuitive operation.
| Wafer Size | 2-4 inch wafers |
|---|---|
| Wafers per Cycle | 1 |
| Stations | 1 |
| Loading | Manual |
| Rotation Speed RPM/MIN | 10-5000 rpm settable, accuracy < 1rpm |
| Cleaning | Double-side chemical / megasonic (optional) / N2 dry |
| Chemical Types | 2 |
| Nozzles | Independent supply top & bottom |
| Chemical Tanks | 2 x 10L PVDF |
| Chemical Supply | PVDF pump or pressure control valve |
| Chemical Flow Control | PFA manual valve 10-1000ml/min |
| Chemical Flow Monitoring | Yes |
| DIW Rinse | Yes |
| DIW Flow Control | PFA manual valve 10-1000ml/min |
| Megasonic Nozzle | Optional |
| N2 Blow | Yes, cone & fan nozzles replaceable |
| Cycle Time | 2-5 min |
| N2 Pressure | 0.15MPa, N2 port 1/4 inch |
| DIW Pressure | 0.15MPa, port 3/8 inch |
| Drain | 2 x phi20mm (water/chemical) |
| Display/Control | 7 inch touch screen + PLC |
| Piping | PFA |
| Power | 220V |
| Power Rating | 3KW |
| Dimensions | L660 x W760 x H1332 mm |
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