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092026.10

Beijing-Tianjin-Hebei IC Cluster Three-Year Plan Lands, Hebei Bets on Compound Semiconductors

The Beijing-Tianjin-Hebei thre…

092026.10

京津冀集成电路集群三年行动落地 河北聚焦化合物半导体特色赛道

京津冀三地联合印发集成电路集群提升发展三年行动方案，北京重设…

082026.10

Global Foundry Output Hits a New Record: TSMC Leads, SMIC Holds Its Ground Among the Top Tier

Boosted by AI chips and high-p…

082026.10

全球晶圆代工产值再创新高 先进制程引领下台积电持续领跑、中芯国际稳居第三梯队前列

TrendForce统计2026年二季度全球前十大晶圆代工营…

082026.10

Semiconductor Material Localization Deepens With Breakthroughs in Large Wafers and ArF Photoresist

China’s semiconductor material…

082026.10

半导体材料国产化纵深突破 大硅片与高端光刻胶配套能力持续增强

中国大陆12英寸硅片国产化率约15%-20%，预计2026年…

072026.10

Automotive-Grade Power Semiconductor Expansion Heats Up as IGBT and SiC Fab Investments Land

Power device makers are announ…

072026.10

车规级功率半导体扩产火热 IGBT与碳化硅产线投资持续落地

斯达半导15亿元可转债投向车规SiC与GaN模块，时代电气I…

072026.10

8-Inch Silicon Carbide Substrate Moves Toward Mass Production as PVT Growth Equipment Enables Localization

Chinese SiC substrate makers a…

072026.10

8英寸碳化硅衬底产业化提速 PVT长晶炉国产替代进入关键窗口期

碳化硅衬底产业正从6英寸向8英寸切换，PVT物理气相传输法为…