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Chiplet and Heterogeneous Integration Heat Up as China’s Advanced Packaging Lines Top 20 Billion RMB
Chiplet and heterogeneous inte…
Chiplet与异构集成持续升温 国内先进封装产线扩产超两百亿
AI算力需求带动先进封装扩产，长电科技78亿元临港建高端封测…
SEMICON China 2026 Opens in Shanghai with 1,500 Exhibitors Charting a New Global Market
SEMICON China 2026 opened in S…
SEMICON China 2026上海开幕 1500家展商共探全球半导体市场新局
SEMICON China 2026于3月25日至27日在上…
The Post-CMP Cleaning Battle: Nanoparticle Removal and Spin-Rinse-Dryer Drying as Yield Defenders
Post-CMP cleaning is the last …
CMP后清洗的良率攻防：纳米颗粒去除与旋转干燥SRD配合
后CMP清洗需在CMP后立即去除浆料纳米颗粒与金属残留，PV…
Domestic 12-Inch Silicon Wafer Capacity Ramps Up to Support Chinese Fab Expansion
Chinese 12-inch wafer makers r…
12英寸半导体硅片产能稳步释放 国产大硅片支撑晶圆厂扩产
沪硅产业300mm硅片产能年底有望达120万片每月，立昂微1…
National IC Industry Fund Phase III Registered at RMB 344 Billion, Targeting Equipment and Materials
China’s National Integrated Ci…
国家大基金三期注册资本3440亿元 加码半导体设备与材料国产化
国家集成电路产业投资基金三期注册资本达3440亿元，重点投向…
