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122026.10

Compound Semiconductor National Standards System Matures as Substrate and Epitaxy Standards Roll Out

China’s compound semiconductor…

122026.10

Global Semiconductor Equipment Sales Set for Another Record in 2026 as Wafer Cleaning Localization Accelerates

Driven by AI capacity expansio…

112026.10

Fab Expansion Forces Facility Upgrades: Cleanrooms, UPW and Specialty Gases as New Infrastructure

Fab expansion is driving facil…

112026.10

China’s Wafer Cleaning Equipment Localization Crosses 50% as Single-Wafer Cleaning and Spin-Dryers Lead Fab Expansion

Domestic wafer cleaning equipm…

102026.10

China’s IC Talent Gap Tops 300,000 as Industry-Education Integration Ramps Up Equipment Engineers

China's integrated circuit tal…

092026.10

Beijing-Tianjin-Hebei IC Cluster Three-Year Plan Lands, Hebei Bets on Compound Semiconductors

The Beijing-Tianjin-Hebei thre…

082026.10

Global Foundry Output Hits a New Record: TSMC Leads, SMIC Holds Its Ground Among the Top Tier

Boosted by AI chips and high-p…

082026.10

Semiconductor Material Localization Deepens With Breakthroughs in Large Wafers and ArF Photoresist

China’s semiconductor material…

072026.10

Automotive-Grade Power Semiconductor Expansion Heats Up as IGBT and SiC Fab Investments Land

Power device makers are announ…

072026.10

8-Inch Silicon Carbide Substrate Moves Toward Mass Production as PVT Growth Equipment Enables Localization

Chinese SiC substrate makers a…

062026.10

AI Data Center Boom Pulls Indium Phosphide Substrate Demand Higher; Tight Supply Persists Into 2026

As 800G and 1.6T optical modul…

062026.10

Mature-Node Utilization Nears Full Capacity as Automotive and Industrial Chips Underpin Fab Load

After a two-year inventory cor…